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Product Categories3D SPI
3D SPI
Perfect application of 3D high-precision contour measurement technology
  • Dual light source
    Dual light source digital projection detection technology, no shadows, high precision
  • Stop-and-go dynamic acquisition
    Intelligent optimization of inspection route, full-page 3D image display, 100% defect coverage
  • Multi-frequency digital grating projection technology
    The detection range is effectively improved, and the height error of the substrate warping is eliminated through the plane fitting algorithm.
  • SPC system
    The quality trend distribution can be provided graphically, and the defects can be predicted in advance. And find out the potential factors causing the trend in advance, adjust in time, and control the spread of the trend.

All-round three-dimensional solder paste status display of the entire board, which really intuitively reflects the printing defect status of the entire board solder paste

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In 3D state, solder paste status display

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Missing print, less tin

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product list
  • Mirage
    Device type: online automatic 3D SPI
    Special features: 3D high-precision contour measurement technology perfect application
    Applicable substrate: 50mm x 70mm-510mm x 460mm
    Substrate thickness: 0.6mm-6.0mm Resolution: 10μm-15μm (adjustable)
    Height measurement accuracy: 1μm
    Dimensions:W1080 x D1300 x H1850(mm)
    Weight: 740KG
    • Contact us
    Suzhou Judu
    www.jutze-sis.com
    Japan Jutze
    www.jutze.co.jp
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